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Advanced Imaging Solutions for Defense, Industry and Medicine |
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Research and Development Engineer: Lickenbrock Technologies is hiring Electrical Engineers with M.S. or PhD degrees who specialize in signal- and image-processing. Most projects involve random signals, inverse problems and advanced concepts of image processing and communications theory. Lickenbrock Technologies, LLC is a growing business with rich opportunities for career growth. Our engineers fall into a unique class of professionals that enjoy the best of both worlds. We are known for developing real products that get delivered to the customer and are supported and maintained by us. We are also known for our publications and advanced research contributions to the professional field. Our engineers are diverse professionals who enjoy the excitement and challenge of conceiving and developing brand new technology, yet also like to see their products used by real customers in the real world. If you have an interest or track record with this diversity, we invite you to apply. Some of our current projects: Segmentation and measurement of optical coherence tomography ophthalmic images. This project utilizes advanced concepts and technology in adaptive segmentation, feature extraction, fuzzy logic, active contours and other advanced methods. The product was released in November 2006. The project is being planned for a new and further advanced product release. This project uses advanced knowledge in active contour algorithms, fuzzy logic, adaptive segmentation, matched filtering and other techniques. Hyperspectral Imaging Advanced Research. This is a concept-stage project. The company is investigating novel techniques for automatically detecting changes, unmixing signals and tracking targets in hyperspectral imaging for military defense and remote sensing. This project uses advanced knowledge in hyperspectral imaging, change detection, inverse problems, iterative optimization methods, and other techniques. Industrial X-ray Computed Tomography. We are researching methods for inverting the effects of finite computed tomography slice thickness. The application is in detecting tiny flaws in manufactured components during nondestructive testing procedures. This project uses advanced knowledge in solving inverse problems, maximum likelihood estimation and computed tomography. |
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